PBT-680Packaging substrate cleaning machine

Process flow:

Outlet into the board - into the board - chemical prewash, chemical cleaning, chemicals wind cut isolation - rinse -- rinse -- rinse -- two spray - dry wind cut 1 finally -- Standby air drying -- hot air circulation drying.

Field of Application:

This machine is used for automatic cleaning of residual flux after welding of all kinds of fingerprint/camera modules, communication, acoustic, radio frequency, power control and other advanced packages.

Suitable FOR CLEANING FLUX Molding BEFORE HIGH PRODUCTION PBGA, FIP-CHIP, SIP, FC, Lead Frame ETC.

Equipment features:

• Automatic cleaning: the product is run in parallel with the width of 600mm mesh belt, and the heated cleaning liquid is sprayed through the spray arm at high pressure, automatic cleaning, rinsing (open loop), drying;

• Visualization of the whole process: toughened glass visualization window, clear cleaning process;

• Scientific nozzle design (patent): use left and right incremental distribution -- thorough cleaning, spray arm, nozzle detachable;

• The visual nozzle pressure can be adjusted: it solves the collision and splashing problem of small workpiece size in cleaning under high-pressure spray conditions;

• The viewing window and entrance are provided with photoelectric protection to prevent the cleaning liquid from spilling out, and the falling plate is detected to ensure its safety;

• Comprehensive cleaning system: standard diluent tank and spray rinse tank are equipped with heating system to improve cleaning efficiency. Shorten cleaning time, compatible with running water washing or chemical cleaning;

• Built-in filtration system for cleaning and recycling, with the function of cleaning liquid concentration compensation, solvent section condensation and recycling, reduce the amount of solvent;

• A UPS reserve power protection is prepared, with emergency stop button and leakage protection functions in case of solid barrier;

• Lower operating costs: lower equipment investment costs, localization services, teams and adequate supply of spare parts.

Technical parameters: