Process flow:
Put in the material -- one button cleaning start -- safety door automatically close -- two fluid cleaning -- centrifugal dehydration (to remove electrostatic ion wind and heating chamber assisted drying)-- cleaning completed -- alarm -- The glass door opens automatically.
High speed centrifugal design, mainly used for precision cleaning of 4-12 inch silicon wafers; With two fluid cleaning, electrostatic elimination/nitrogen, high-speed centrifugation devices, so that the cleaned parts to achieve the purpose of dry, clean.
Field of Application:
The PVT-650 wafer cleaning machine is suitable for precision cleaning of various camera modules and wafers.
Equipment features:
• Replaceable cleaning suckers can be used with 4-12 inch cleaning suckers;
• The operating procedure can be prepared and adjusted according to the operation requirements, and the equipment operation process, cleaning time and various parameters can be prepared by themselves;
• The operating status and parameters of the equipment are monitored online in real time. The automatic door is equipped with safety grating to ensure the safety of operation.
• Adopt vacuum adsorption cleaning disc, the chip fixture is more safe and convenient to take and place;
• Swing arm cleaning, cleaning range can be compiled, wide range of application, no cleaning blind area, no secondary pollution, cleaning effect is better;
• The cleaning room of the equipment is fully sealed and equipped with automatic water retaining ring to effectively prevent secondary pollution;
• High speed centrifugal design, speed can be adjusted 100-2000r /Min;
• Equipped with unique electrostatic elimination device to assist cleaning for best results, nitrogen is optional;
• The equipment is equipped with large area transparent observation window;
• Space-saving design with reduced width, compact structure and small occupancy;
• The whole machine mirror stainless steel body, acid and alkali resistance, no pollution to the working environment, the mirror case is easy to maintain.
Technical parameters: